The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2020

Filed:

Jun. 08, 2016
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Michael L. Andersen, Denver, CO (US);

Travis L. Mayberry, Dallas, TX (US);

James A. Pruett, Allen, TX (US);

John S. Moore, Indianapolis, IN (US);

Assignee:

Raytheon Company, Waltham, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23P 15/26 (2006.01); B23K 20/10 (2006.01); H01L 21/48 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
B23P 15/26 (2013.01); B23K 20/10 (2013.01); H01L 21/4871 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12);
Abstract

A manifold structure and method of forming a manifold structure includes using an ultrasonic additive manufacturing (UAM) process to build up a solid structure, machining the solid structure to form a cavity and free-standing support pillars within the cavity, and using a UAM process to build up a finstock layer over the cavity. The support pillars formed by machining have yield strengths high enough to support UAM of the finstock layer over the cavity. A plurality of finstock layers are built up within the cavity to segment the cavity into a plurality of cavities. UAM of the finstock layers enables the finstock layers to be stacked in a direction normal to a direction of flow through the cavity for efficiently transferring heat through the manifold structure.


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