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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10682697 B1

PDFFull Text
Date of Patent:
Jun. 16, 2020

Filed:

Feb. 20, 2018

Compound for metal powder injection molding, metal powder molded body, method for producing sintered body, and sintered body

Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Hidefumi Nakamura, Hachinohe, JP;

Yasutoshi Hideshima, Matsumoto, JP;

Assignee:

Seiko Epson Corporation, , JP;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Daniel J Schleis

Int. Cl.
CPC ...
B22F 1/00 (2006.01); B22F 3/22 (2006.01); B22F 3/10 (2006.01); B22F 9/02 (2006.01); B22F 3/24 (2006.01); B22F 9/08 (2006.01); C22C 32/00 (2006.01);
U.S. Cl.
CPC ...
B22F 1/0059 (2013.01); B22F 1/0074 (2013.01); B22F 3/22 (2013.01); B22F 3/225 (2013.01); B22F 1/0096 (2013.01); B22F 3/1007 (2013.01); B22F 3/24 (2013.01); B22F 9/026 (2013.01); B22F 9/082 (2013.01); B22F 2001/0066 (2013.01); B22F 2003/247 (2013.01); B22F 2301/35 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); C22C 32/00 (2013.01);
Abstract

A compound for metal powder injection molding includes secondary particles in which first metal particles are bound to one another, and a matrix region including a binder and second metal particles whose constituent material is different from that of the first metal particles. It is preferred that in the secondary particles, the first metal particles are bound to one another through the binder. It is also preferred that the average particle diameter of the second metal particles is smaller than that of the first metal particles.

Find Patent Forward Citations

Nakamura, Hidefumi. (2020). Compound for metal powder injection molding, metal powder molded body, method for producing sintered body, and sintered body (U.S. Patent No. 10682697). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10682697

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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