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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10682674 B1

PDFFull Text
Date of Patent:
Jun. 16, 2020

Filed:

Oct. 27, 2017

Apparatus and method for treating substrate

Applicant:

Semes Co., Ltd., Cheonan-si, Chungcheongnam-do, KR;

Inventors:

Younghun Jung, Asan-si, KR;

Chang Uk Park, Cheonan-si, KR;

Assignee:

SEMES CO., LTD., Chungcheongnam-Do, KR;

Attorney:

Procopio, Cory, Hargreaves & Savitch LLP

Primary Examiner:

Eric W Golightly

Int. Cl.
CPC ...
B08B 3/10 (2006.01); B08B 11/02 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); B05B 9/00 (2006.01); B05C 11/10 (2006.01); B08B 3/08 (2006.01); C11D 11/00 (2006.01); H01L 21/02 (2006.01); B08B 3/02 (2006.01);
U.S. Cl.
CPC ...
B08B 3/10 (2013.01); B05B 9/002 (2013.01); B05C 11/1042 (2013.01); B08B 3/08 (2013.01); B08B 11/02 (2013.01); C11D 11/0047 (2013.01); H01L 21/02052 (2013.01); H01L 21/6715 (2013.01); H01L 21/6719 (2013.01); H01L 21/67028 (2013.01); H01L 21/67051 (2013.01); H01L 21/67103 (2013.01); H01L 21/67178 (2013.01); H01L 21/6838 (2013.01); H01L 21/6875 (2013.01); H01L 21/68764 (2013.01); H01L 21/68785 (2013.01); B08B 3/024 (2013.01); B08B 2203/0229 (2013.01);
Abstract

Embodiments of the inventive concept relate to an apparatus and a method for removing a liquid residing on a substrate. The substrate treating apparatus includes a substrate support unit configured to support the substrate, a liquid supply unit configured to supply a liquid onto the substrate supported by the substrate support unit, and a heating unit configured to heat the substrate supported by the substrate support unit, wherein the substrate support unit includes a support plate having a seating surface, on which the substrate is seated, and having a suction hole on the seating surface, a rotary shaft configured to rotate the support plate, and a vacuum member configured to reduce a pressure of the suction hole such that the substrate seated on the seating surface is vacuum-suctioned on the support plate. Accordingly, the drying efficiency of the substrate may be increased.

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