The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2020
Filed:
Mar. 28, 2018
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Norihiko Sakamoto, Tokyo, JP;
Hiroshi Yokota, Tokyo, JP;
Shintaro Hashimoto, Tokyo, JP;
Katsuhiko Nawate, Tokyo, JP;
Shinji Tsuchikawa, Tokyo, JP;
Shin Takanezawa, Tokyo, JP;
Assignee:
HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 3/46 (2006.01); C08J 5/24 (2006.01);
U.S. Cl.
CPC ...
H05K 1/036 (2013.01); C08J 5/24 (2013.01); H05K 1/0373 (2013.01); H05K 3/4632 (2013.01);
Abstract
The present invention provides a prepreg for a coreless substrate including a thermosetting resin composition containing (a) (meth)acrylic elastomer, (b) an amine compound having at least two primary amino groups, and (c) a maleimide compound having at least two N-substituted maleimide groups, and a coreless substrate using the same, a method of manufacturing the coreless substrate, and a semiconductor package.