The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Sep. 11, 2018
Applicant:

Db Hitek Co., Ltd., Gangnam-gu Seoul, KR;

Inventor:

Jong Won Sun, Gyeonggi-do, KR;

Assignee:

DB HITEK CO., LTD., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/04 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); H04R 19/00 (2006.01); H04R 7/18 (2006.01); H04R 31/00 (2006.01); H04R 7/04 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); B81B 3/0051 (2013.01); B81C 1/00039 (2013.01); H04R 7/18 (2013.01); H04R 19/005 (2013.01); H04R 31/003 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0307 (2013.01); B81C 2201/0109 (2013.01); B81C 2201/0132 (2013.01); H04R 7/04 (2013.01); H04R 31/00 (2013.01); H04R 2201/003 (2013.01);
Abstract

A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate, the back plate having a plurality of acoustic holes, a diaphragm interposed between the substrate and the back plate, and being spaced apart from the substrate and the back plate, the diaphragm covering the cavity, forming an air gap between the back plate, and sensing an acoustic pressure to generate a displacement, and a plurality of anchors extending from an end portion of the diaphragm and along a circumference of the diaphragm, each of the anchors having a serpentine shape in a plan view and including a bottom portion making contact with an upper surface of the substrate to support the diaphragm from the substrate. Thus, the MEMS microphone may have adjustable area of the slit.


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