The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Feb. 09, 2018
Applicant:

Dai Nippon Printing Co., Ltd., Tokyo, JP;

Inventors:

Yoshiaki Tsuruoka, Tokyo, JP;

Masaaki Asano, Tokyo, JP;

Shinji Maekawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); H01L 27/146 (2006.01); H01L 31/0224 (2006.01); G02B 7/08 (2006.01); G02B 7/02 (2006.01); G02B 13/16 (2006.01); G02B 5/20 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2257 (2013.01); G02B 7/08 (2013.01); H01L 27/1462 (2013.01); H01L 27/14627 (2013.01); H01L 31/022408 (2013.01); H04N 5/2254 (2013.01); G02B 5/208 (2013.01); G02B 7/021 (2013.01); G02B 13/16 (2013.01); H01L 27/14621 (2013.01); H01L 27/14636 (2013.01);
Abstract

An image sensor module includes an interposer substrate having a first surface and a second surface opposite to the first surface, the interposer substrate being light-transmissive and having a plurality of through-holes; an image sensor located to face the first surface of the interposer substrate, the image sensor having a light receiving surface on a side of the interposer substrate, a plurality of photoelectric conversion elements being located at the light receiving surface, the image sensor being connected with an external circuit via electrodes provided in the plurality of through-holes; and a lens unit located to face the second surface of the interposer substrate.


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