The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Dec. 17, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Kiyoun Jang, Suwon-si, KR;

Chulwoo Park, Suwon-si, KR;

Hyundeok Seo, Hwaseong-si, KR;

Se-Young Jang, Seongnam-si, KR;

Chi-Hyun Cho, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02J 50/90 (2016.01); H02J 7/02 (2016.01); H05K 1/18 (2006.01); H04B 5/00 (2006.01); H05K 1/16 (2006.01); H02J 50/12 (2016.01); H01F 38/14 (2006.01); H05K 1/02 (2006.01); H04M 1/02 (2006.01); H05K 3/42 (2006.01); G01K 13/00 (2006.01);
U.S. Cl.
CPC ...
H02J 50/90 (2016.02); H01F 38/14 (2013.01); H02J 7/025 (2013.01); H02J 50/12 (2016.02); H04B 5/0031 (2013.01); H04B 5/0037 (2013.01); H04B 5/0081 (2013.01); H05K 1/165 (2013.01); H05K 1/181 (2013.01); G01K 13/00 (2013.01); H04M 1/0262 (2013.01); H04M 1/0277 (2013.01); H04M 2250/12 (2013.01); H05K 1/0203 (2013.01); H05K 1/0298 (2013.01); H05K 3/429 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10037 (2013.01); H05K 2201/10151 (2013.01);
Abstract

Various embodiments of the present disclosure may provide an electronic device that includes: a first plate directed in a first direction, a second plate directed in a second direction opposite to the first direction, and a side member configured to surround at least a part of the space between the first and second plates; a first printed circuit board (PCB) that is disposed between the first and second plates and includes at least one processor; a second printed circuit board (PCB) that is disposed between the first printed circuit board and the second plate and includes at least one antenna pattern; and a temperature sensor disposed to measure the temperature of at least a part of the second printed circuit board. Other various embodiments are possible.


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