The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Mar. 01, 2019
Applicant:

Sharp Kabushiki Kaisha, Sakai, Osaka, JP;

Inventors:

Shigetoshi Ito, Sakai, JP;

Kazuaki Kaneko, Sakai, JP;

Teruyuki Oomatsu, Sakai, JP;

Assignee:

SHARP KABUSHIKI KAISHA, Sakai, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/024 (2006.01); H01S 5/022 (2006.01); H01S 5/40 (2006.01); H01S 5/02 (2006.01); H01S 5/00 (2006.01); H01S 5/323 (2006.01); H01S 5/0683 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02469 (2013.01); H01S 5/02 (2013.01); H01S 5/02212 (2013.01); H01S 5/02276 (2013.01); H01S 5/02296 (2013.01); H01S 5/323 (2013.01); H01S 5/4025 (2013.01); H01S 5/005 (2013.01); H01S 5/02216 (2013.01); H01S 5/02292 (2013.01); H01S 5/0683 (2013.01);
Abstract

A semiconductor light-emitting deviceincludes a heat sink and a semiconductor light-emitting element mounted on the heat sink. A gap is provided between a region of a part of a base bottom surface of a base of the semiconductor light-emitting element and an upper surface of the heat sink, and a lead is disposed in a region where the gap is provided so as to vertically pass through the base. A semiconductor laser chip is provided in a region where the gap is not provided so that its waveguide longitudinal direction is substantially parallel to an upper surface of the base. The lead has its lower end located within the gap and connected to a flexible substrate.


Find Patent Forward Citations

Loading…