The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Dec. 11, 2018
Applicants:

Chengdu Boe Optoelectronics Technology Co., Ltd., Chengdu, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Zi Qiao, Beijing, CN;

Zhiliang Jiang, Beijing, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5253 (2013.01); H01L 27/3246 (2013.01);
Abstract

Disclosed are an encapsulation structure, a substrate and a display panel. The package structure includes an encapsulation layer and a transition layer, wherein the encapsulation layer includes a first encapsulation layer and a second encapsulation layer which are laminated with each other, the first encapsulation layer is located on a first main surface of the second encapsulation layer, the transition layer and the first encapsulation layer are juxtaposed on the first main surface, the first main surface includes a first region in contact with the first encapsulation layer and a second region in contact with the transition layer, the second region is located at an edge of the first main surface, and a bonding strength between the transition layer and the second encapsulation layer is greater than a bonding strength between the first encapsulation laver and the second encapsulation layer.


Find Patent Forward Citations

Loading…