The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2020
Filed:
Dec. 18, 2015
Applicant:
Snaptrack, Inc., San Diego, CA (US);
Inventors:
Thomas Metzger, München, DE;
Jürgen Portmann, München, DE;
Assignee:
SnapTrack, Inc., San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/053 (2006.01); H03H 9/05 (2006.01); B81B 7/02 (2006.01); H01L 41/047 (2006.01); H01L 41/08 (2006.01); H01L 41/23 (2013.01);
U.S. Cl.
CPC ...
H01L 41/053 (2013.01); B81B 7/02 (2013.01); H01L 41/047 (2013.01); H01L 41/0533 (2013.01); H01L 41/081 (2013.01); H01L 41/23 (2013.01); H03H 9/0547 (2013.01); B81B 2207/012 (2013.01); B81B 2207/095 (2013.01); B81C 2203/0118 (2013.01); B81C 2203/0136 (2013.01); B81C 2203/0145 (2013.01); B81C 2203/0154 (2013.01); H01L 2221/00 (2013.01); H01L 2224/11 (2013.01);
Abstract
A MEMS component having increased integration density and a method for manufacturing such a component are specified. The component comprises a base wafer and a cover wafer arranged over this. A first cavity is arranged between the base wafer and the cover wafer. A second cavity is arranged over the cover wafer, below a thin-layer covering. The cavities contain component structures.