The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Jan. 24, 2019
Applicant:

Xiamen Eco Lighting Co. Ltd., Xiamen, CN;

Inventors:

Hong Kui Jiang, Xiamen, CN;

Hui Wu Chen, Xiamen, CN;

Yan Biao Chen, Xiamen, CN;

Wei Liu, Xiamen, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/52 (2010.01); H01L 27/15 (2006.01); H05B 45/20 (2020.01); H05B 45/44 (2020.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 27/15 (2013.01); H01L 33/52 (2013.01); H05B 45/20 (2020.01); H05B 45/44 (2020.01);
Abstract

A packaged illuminating device includes a hybrid light emitting device, a first plurality of bonding wires, a linear constant current circuit, a soldering plate, a second plurality of bonding wires and a protection layer. The hybrid light emitting device includes a plurality of illuminating elements having different or partially same luminance properties. The plurality of illuminating elements are disposed in respective proximities. The linear constant current circuit is electrically coupled to the hybrid light emitting device via the first plurality of bonding wires at a first plurality of pins of the linear constant current circuit. The linear constant current circuit powers up the plurality of illuminating elements using a constant DC voltage and controls duty cycles. The protection layer encapsulates the hybrid light emitting device, the first plurality of bonding wires, the linear constant current circuit, and the second plurality of bonding wires with the aid of the soldering plate.


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