The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2020
Filed:
Aug. 03, 2018
Everlight Electronics Co., Ltd., New Taipei, TW;
Ke-Hao Pan, New Taipei, TW;
Sheng-Wei Chou, New Taipei, TW;
Yi-Sheng Lan, New Taipei, TW;
Chia-Fong Chou, New Taipei, TW;
Chung-Chuan Hsieh, New Taipei, TW;
Jen-Hao Pan, New Taipei, TW;
Hao-Yu Yang, New Taipei, TW;
Chieh-Yu Kang, New Taipei, TW;
Tzu-Lun Tseng, New Taipei, TW;
EVERLIGHT ELECTRONICS CO., LTD., New Taipei, TW;
Abstract
The present disclosure provides an LED package structure and a method for manufacturing the LED package structure. The LED package structure includes: a chip scale package (CSP) light emitting element and a shading layer, where the CSP light emitting element includes a light emitting chip, and the light emitting chip includes an electrode group located on a bottom surface of the light emitting chip, the shading layer is disposed on a bottom surface and/or a side surface of the CSP light emitting element. An LED package structure according to the present disclosure solves a problem that the blue light leaking from the bottom surface of the LED chip interferes with the emission color of the CSP emitting device, and reduces the luminous efficiency of the emitting device.