The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Jul. 06, 2015
Applicant:

Sumitomo Electric Industries, Ltd., Osaka-shi, JP;

Inventors:

Kazumasa Toya, Osaka, JP;

Takashi Iwasaki, Osaka, JP;

Youichi Nagai, Osaka, JP;

Koji Mori, Osaka, JP;

Kenji Saito, Osaka, JP;

Rui Mikami, Osaka, JP;

Takeshi Yamana, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0392 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 31/05 (2014.01); H02S 40/22 (2014.01); H02S 20/32 (2014.01); H02S 30/10 (2014.01); H01L 31/02 (2006.01); H01L 31/054 (2014.01); H02S 40/42 (2014.01);
U.S. Cl.
CPC ...
H01L 31/03926 (2013.01); H01L 31/02013 (2013.01); H01L 31/0508 (2013.01); H01L 31/0543 (2014.12); H02S 20/32 (2014.12); H02S 30/10 (2014.12); H02S 40/22 (2014.12); H02S 40/42 (2014.12); H05K 1/028 (2013.01); H05K 1/189 (2013.01); H05K 2201/046 (2013.01); H05K 2201/09263 (2013.01); H05K 2201/10121 (2013.01); Y02E 10/52 (2013.01);
Abstract

This power generation circuit unit includes a wiring substrate and a plurality of power generating elements mounted to the wiring substrate. The wiring substrate includes: a first substrate (E) and a second substrate (F) to each of which the power generating element is mounted; and a coupling portion (L) configured to couple the first substrate (E) and the second substrate (F) together. The first substrate (E) can be disposed at least two positions of: a first position separated from the second substrate (F) by a first distance; and a second position separated from the second substrate (F) by a second distance being greater than the first distance. The coupling portion (L) has an FPC (flexible printed circuits). In a state where the first substrate is disposed at the second position, at least a part of the coupling portion (L) is twisted.


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