The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Jan. 11, 2019
Applicant:

Koninklijke Philips N.v., Eindhoven, NL;

Inventor:

Marc Anthony Chappo, Elyria, OH (US);

Assignee:

KONINKLIJKE PHILIPS N.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 27/146 (2006.01); H01L 27/00 (2006.01); H01L 23/367 (2006.01); H01L 31/00 (2006.01); H01L 31/18 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); A61B 6/03 (2006.01); A61B 6/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1469 (2013.01); H01L 23/3675 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 27/14618 (2013.01); H01L 27/14661 (2013.01); H05K 1/18 (2013.01); A61B 6/032 (2013.01); A61B 6/4233 (2013.01); H01L 27/14663 (2013.01); H01L 2224/131 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/14135 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/81815 (2013.01); H05K 3/3436 (2013.01); H05K 2201/1053 (2013.01); H05K 2201/10151 (2013.01);
Abstract

A module assembly device () is configured for assembling a module assembly () for a detector array () of an imaging system (). The module assembly device includes a base () having a long axis (). The module assembly device further includes a first surface () of the base and side walls () protruding perpendicular up from the first surface and extending in a direction of the long axis along at least two sides of the base. The first surface and side walls form a recess () configured to receive the module substrate on the surface and within the side walls. The module assembly device further includes protrusions () protruding from the side walls in a direction of the side walls. The protrusions and side walls interface forming a ledge which serves as a photo-detector array tile support () configured to receive the photo-detector array tile () over the ASIC and the module substrate.


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