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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10679965 B1

PDFFull Text
Date of Patent:
Jun. 09, 2020

Filed:

Feb. 02, 2016

Semiconductor package structure with preferred heat dissipating efficacy without formation of short circuit

Applicant:

Zowie Technology Corporation, New Taipei, TW;

Inventors:

Chia-Wei Li, New Taipei, TW;

Yen-Ni Hu, New Taipei, TW;

Assignee:

ZOWIE TECHNOLOGY CORPORATION, New Taipei, TW;

Attorney:

Bacon & Thomas, PLLC

Primary Examiner:

Cuong Q Nguyen

Assistant Examiner:

Shih Tsun A Chou

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/051 (2006.01);
U.S. Cl.
CPC ...
H01L 24/96 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/051 (2013.01); H01L 23/3107 (2013.01); H01L 23/49537 (2013.01); H01L 24/97 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/30 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/27848 (2013.01); H01L 2224/293 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/30181 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/17747 (2013.01); H01L 2924/1811 (2013.01);
Abstract

A semiconductor package structure and manufacturing method thereof are provided, and the semiconductor package structure includes a semiconductor element, a top substrate, a bottom substrate, an insulating layer, and two metal conductive layers. The top substrate is mainly made of a conductive metal, and having a first separated portion on the top substrate, the first separated portion divides the top substrate into two blocks which are not electrically connected to each other. The bottom substrate is mainly made of the conductive metal, and having a second separated portion on the bottom substrate. The second separated portion divides the bottom substrate into two blocks which are not electrically connected to each other. The insulating layer is disposed between the top substrate and the bottom substrate. The metal conductive layer is disposed at two sides of the insulating layer and connected to the top substrate and the bottom substrate. The semiconductor element is contacted with the top substrate and the bottom substrate.

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Li, Chia-Wei. (2020). Semiconductor package structure with preferred heat dissipating efficacy without formation of short circuit (U.S. Patent No. 10679965). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10679965

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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