The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2020
Filed:
Oct. 19, 2017
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 25/10 (2006.01); H01L 23/552 (2006.01); H01L 25/03 (2006.01);
U.S. Cl.
CPC ...
H01L 24/06 (2013.01); H01L 23/13 (2013.01); H01L 23/3675 (2013.01); H01L 23/3677 (2013.01); H01L 23/5389 (2013.01); H01L 23/552 (2013.01); H01L 24/09 (2013.01); H01L 24/14 (2013.01); H01L 24/17 (2013.01); H01L 24/19 (2013.01); H01L 24/97 (2013.01); H01L 25/105 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/5386 (2013.01); H01L 25/03 (2013.01); H01L 2224/02311 (2013.01); H01L 2224/02319 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06131 (2013.01); H01L 2224/06136 (2013.01); H01L 2224/06151 (2013.01); H01L 2224/06155 (2013.01); H01L 2224/06159 (2013.01); H01L 2224/06177 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/06182 (2013.01); H01L 2224/06519 (2013.01); H01L 2224/09181 (2013.01); H01L 2224/09519 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/14136 (2013.01); H01L 2224/14151 (2013.01); H01L 2224/14155 (2013.01); H01L 2224/14177 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17519 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/96 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A semiconductor package includes a substrate portion including a core layer having a device accommodating portion formed therein, and a buildup layer stacked on each of opposing sides of the core layer; an electronic device disposed in the device accommodating portion; and heat dissipating conductors disposed in the buildup layer to externally emit heat generated by the electronic device.