The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2020
Filed:
Aug. 30, 2018
Applicant:
Eoplex Limited, Hong Kong, CN;
Inventors:
David G. Love, Aptos, CA (US);
Philip Eugene Rogren, Half Moon Bay, CA (US);
Assignee:
EoPLex Limited, Hong Kong, CN;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 24/03 (2013.01); H01L 24/96 (2013.01); H01L 23/3114 (2013.01); H01L 23/3192 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/94 (2013.01); H01L 2224/031 (2013.01); H01L 2224/03003 (2013.01); H01L 2224/0311 (2013.01); H01L 2224/0312 (2013.01); H01L 2224/0344 (2013.01); H01L 2224/0347 (2013.01); H01L 2224/0391 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03505 (2013.01); H01L 2224/03845 (2013.01); H01L 2224/03914 (2013.01); H01L 2224/051 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05084 (2013.01); H01L 2224/05109 (2013.01); H01L 2224/05111 (2013.01); H01L 2224/05116 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05171 (2013.01); H01L 2224/05184 (2013.01); H01L 2224/05556 (2013.01); H01L 2224/05609 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05616 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/11312 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11422 (2013.01); H01L 2224/11428 (2013.01); H01L 2224/131 (2013.01); H01L 2224/94 (2013.01); H01L 2224/96 (2013.01); H01L 2924/00012 (2013.01);
Abstract
A method of manufacture of an integrated circuit system includes: providing a semiconductor wafer with a bond pad; attaching a detachable carrier to the semiconductor wafer, the detachable carrier including a carrier frame portion and a terminal structure; removing the carrier frame portion with the terminal structure attached to the semiconductor wafer; and forming an encapsulation encapsulating the semiconductor wafer, the bond pad, and the terminal structure.