The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Oct. 31, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Stephen M. Hugo, Stewartville, MN (US);

Mark J. Jeanson, Rochester, MN (US);

Matthew S. Kelly, Oakville, CA;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/495 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 23/3677 (2013.01); H01L 23/49541 (2013.01); H05K 1/0206 (2013.01); H05K 1/181 (2013.01); H05K 3/303 (2013.01); H05K 2203/166 (2013.01); H05K 2203/167 (2013.01); Y02P 70/611 (2015.11); Y02P 70/613 (2015.11);
Abstract

Bottom terminated components and methods of making bottom terminated components are provided. The bottom terminated component includes a die paddle and at least one die paddle structure configured to prevent wicking into a respective thermal via of a printed circuit board. The at least one die paddle structure includes a base defining an axis, the base having an axial thickness extending from the die paddle, and a contact surface configured to contact the printed circuit board at the thermal via of the printed circuit board to prevent wicking of solder into the respective thermal via.


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