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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10679925 B1

PDFFull Text
Date of Patent:
Jun. 09, 2020

Filed:

Mar. 10, 2017

Adhesive for semiconductor mounting, and semiconductor sensor

Applicant:

Sekisui Chemical Co., Ltd., Osaka, Osaka, JP;

Inventors:

Saori Ueda, Kouka, JP;

Yasuyuki Yamada, Kouka, JP;

Assignee:

SEKISUI CHEMICAL CO., LTD., Osaka, JP;

Attorney:

Cheng Law Group, PLLC

Primary Examiner:

Long Pham

Int. Cl.
CPC ...
H01L 23/482 (2006.01); C09J 183/04 (2006.01); H01L 29/84 (2006.01); C09J 11/00 (2006.01); G01L 9/00 (2006.01); H01L 23/00 (2006.01); C09J 171/02 (2006.01); C09J 11/08 (2006.01); C09J 9/02 (2006.01); H01L 21/52 (2006.01); H01L 23/31 (2006.01); C08G 65/336 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4828 (2013.01); C09J 9/02 (2013.01); C09J 11/00 (2013.01); C09J 11/08 (2013.01); C09J 171/02 (2013.01); C09J 183/04 (2013.01); G01L 9/00 (2013.01); H01L 21/52 (2013.01); H01L 23/3114 (2013.01); H01L 24/29 (2013.01); H01L 24/73 (2013.01); H01L 29/84 (2013.01); C08G 65/336 (2013.01); C09J 2203/326 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/0568 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/05684 (2013.01); H01L 2224/2612 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83138 (2013.01); H01L 2224/83855 (2013.01);
Abstract

Provided is an adhesive for semiconductor mounting that can achieve high-precision gap control and can increase heat resistance when a semiconductor is mounted. An adhesive for semiconductor mounting according to the present invention is an adhesive that is used for mounting a semiconductor, and contains a silicone resin and a spacer, the content of the spacer being 0.1% by weight or more and 5% by weight or less in 100% by weight of the adhesive, the 10% compressive elasticity modulus of the spacer being 5000 N/mmor more and 15000 N/mmor less, and the average particle diameter of the spacer being 10 μm or more and 200 μm or less.

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