The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

May. 17, 2017
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Koji Kadono, Kanagawa, JP;

Shinji Imaizumi, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C01B 21/064 (2006.01); C01G 39/06 (2006.01); C23C 16/46 (2006.01); C23C 16/52 (2006.01); C23C 16/54 (2006.01); H01L 21/02 (2006.01); H01L 31/18 (2006.01); H01L 33/00 (2010.01); H01L 33/42 (2010.01); H01L 21/285 (2006.01); C23C 14/56 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0262 (2013.01); C01B 21/064 (2013.01); C01G 39/06 (2013.01); C23C 14/56 (2013.01); C23C 16/46 (2013.01); C23C 16/52 (2013.01); C23C 16/54 (2013.01); H01L 21/0254 (2013.01); H01L 21/02425 (2013.01); H01L 21/02444 (2013.01); H01L 21/02527 (2013.01); H01L 21/02568 (2013.01); H01L 21/285 (2013.01); H01L 31/18 (2013.01); H01L 31/1804 (2013.01); H01L 31/1856 (2013.01); H01L 31/1884 (2013.01); H01L 33/007 (2013.01); H01L 33/0054 (2013.01); H01L 33/42 (2013.01); C01P 2006/40 (2013.01); H01L 2933/0016 (2013.01);
Abstract

A thin-film manufacturing method, a thin-film manufacturing apparatus, a manufacturing method for a photoelectric conversion element, a manufacturing method for a logic circuit, a manufacturing method for a light-emitting element, and a manufacturing method for a light control element with which number-of-layers control and laminating and film-forming of different kinds of materials is described. A thin-film manufacturing method according to the present technology includes bringing an electrically conductive film-forming target into contact with a first terminal and a second terminal, heating a first region that is a region of the film-forming target between the first terminal and the second terminal by applying voltage between the first terminal and the second terminal, supplying a film-forming raw material to the first region; and forming a thin film in the first region by controlling reaction time such that a thin film having a desired number of layers is formed.


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