The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Jan. 10, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Gopu Krishna, Bengaluru, IN;

Ravikumar Patil, Bengaluru, IN;

Hanish Kumar Panavalappil Kumarankutty, Bengaluru, IN;

Somil Kapadia, Mumbai, IN;

Sonny Kunnakkat, Bengaluru, IN;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 16/50 (2006.01); C23C 16/458 (2006.01); C23C 16/44 (2006.01); H01L 21/02 (2006.01); H01L 21/285 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32513 (2013.01); C23C 16/4412 (2013.01); C23C 16/458 (2013.01); C23C 16/4586 (2013.01); C23C 16/50 (2013.01); H01J 37/32724 (2013.01); H01J 37/32834 (2013.01); H01J 37/32899 (2013.01); H01J 2237/2001 (2013.01); H01J 2237/20235 (2013.01); H01J 2237/3321 (2013.01); H01J 2237/3323 (2013.01); H01L 21/02274 (2013.01); H01L 21/28556 (2013.01);
Abstract

Implementations of the present disclosure generally relate to apparatus and methods for uniform deposition of thin films on substrates. In one implementation, a plasma-processing chamber comprises a chamber body including chamber walls, a chamber floor, and a lid support. The plasma-processing chamber further comprises a substrate support assembly at least partially disposed within the chamber body and configured to support a substrate. The plasma-processing chamber further comprises a lid assembly disposed over the support assembly and positioned on the lid support wherein the lid assembly and the chamber body define a first processing volume. The plasma-processing chamber further comprises a bottom isolation assembly that circumscribes at least a portion of the substrate support assembly and is vertically movable from a loading position to a processing position. A seal is formed between the bottom isolation assembly and the lid assembly when the bottom isolation assembly is in the processing position.


Find Patent Forward Citations

Loading…