The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Dec. 10, 2018
Applicant:

Magnecomp Corporation, Murrieta, CA (US);

Inventors:

Kuen Chee Ee, Chino, CA (US);

Sitthipong Footrakul, Wangnoi, TH;

Thana Meesomphop, Wangnoi, TH;

Assignee:

Magnecomp Corporation, Murrieta, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/48 (2006.01); G11B 5/55 (2006.01); G11B 5/31 (2006.01);
U.S. Cl.
CPC ...
G11B 5/484 (2013.01); G11B 5/483 (2015.09); G11B 5/4826 (2013.01); G11B 5/5552 (2013.01); G11B 5/31 (2013.01);
Abstract

Embodiments of an adhesive containment structure are provided herein. The suspension includes a base portion that includes a metal support layer, an insulation layer including an insulating material on the metal support layer, and a signal conductor layer. The suspension includes a gimbaled portion, a microactuator adhered to the support layer. The suspension also includes an adhesive containment structure, the adhesive containment structure includes a first portion of the insulating material, a second portion of the insulating material, and a third portion of the insulating material, the first and second portions of the insulating material being separated by a gap, and the third portion of the insulating material disposed within the gap. Adhesive is disposed within the gap of the adhesive containment structure, the adhesive adhering the microactuator to the third portion of the insulating material.


Find Patent Forward Citations

Ee, Kuen. (2020). Partial etched polyimide for non-conductive adhesive containment (U.S. Patent No. 10679652). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10679652

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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