The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Apr. 26, 2016
Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Naoyuki Matsuo, Osaka, JP;

Satoru Furuyama, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G10K 11/00 (2006.01); C08J 9/00 (2006.01); B32B 3/26 (2006.01); B32B 27/36 (2006.01); H04R 1/08 (2006.01);
U.S. Cl.
CPC ...
G10K 11/002 (2013.01); B32B 3/266 (2013.01); B32B 27/36 (2013.01); C08J 9/00 (2013.01); H04R 1/086 (2013.01); B32B 2307/10 (2013.01);
Abstract

A polymer resin film of the present disclosure has a plurality of through holes extending through the thickness of the polymer resin film. The through holes penetrate a substrate structure of the resin film. The through holes have openings formed in both a first principal surface and a second principal surface of the film. The through holes have a shape in which the area of a cross-section perpendicular to a direction in which the through holes extend is constant from the first principal surface of the film to the second principal surface of the film or increases from the first principal surface toward the second principal surface. The openings in the first principal surface have a diameter of 3 μm or more and 80 μm or less. A variation in a porosity defined by the openings in the first principal surface is 10% or less.


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