The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2020
Filed:
Mar. 27, 2019
Huawei Technologies Co., Ltd., Shenzhen, Guangdong, CN;
HUAWEI TECHNOLOGIES CO., LTD., Shenzhen, Guangdong, CN;
Abstract
A memory extensible chip () is provided. The chip () includes a substrate (), and a processor (), a first memory module set (), and a second memory module set () that are integrated on the substrate (). The processor () communicates with at least one memory module in the first memory module set () using a first communications interface (), and the processor () communicates with at least one memory module in the second memory module set () using a second communications interface (). A memory module in the first memory module set () communicates with a memory module in the second memory module set () using a substrate network, where the substrate network is a communications network located inside the substrate (). In this way, the processor () can access a memory module in the first memory module set () by using the second memory module set ().