The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Feb. 12, 2018
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventors:

Takuya Hongo, Kanagawa, JP;

Rei Kimura, Tokyo, JP;

Tomonao Takamatsu, Kanagawa, JP;

Chikako Iwaki, Tokyo, JP;

Hideki Horie, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25B 39/00 (2006.01); F28D 15/00 (2006.01); F25B 47/00 (2006.01); F28D 15/02 (2006.01); G21C 15/02 (2006.01); G21C 15/28 (2006.01); F25B 23/00 (2006.01); H01L 23/427 (2006.01); F28D 15/06 (2006.01); F25B 39/04 (2006.01); F25B 39/02 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
F25B 39/00 (2013.01); F25B 23/006 (2013.01); F25B 47/006 (2013.01); F28D 15/025 (2013.01); F28D 15/0258 (2013.01); F28D 15/0266 (2013.01); F28D 15/0275 (2013.01); F28D 15/0283 (2013.01); F28D 15/06 (2013.01); G21C 15/02 (2013.01); G21C 15/28 (2013.01); H01L 23/427 (2013.01); F25B 39/02 (2013.01); F25B 39/04 (2013.01); F25B 2600/027 (2013.01); F28D 2021/0029 (2013.01); F28D 2021/0054 (2013.01);
Abstract

According to one embodiment, a heat transport apparatus includes an evaporator, a cooling unit, a channel structure, and a heating mechanism. The evaporator vaporizes a refrigerant by heat generated by a heat-generating element. The cooling unit is provided above the evaporator and cools and condenses the refrigerant vaporized in the evaporator. The channel structure constitutes a channel through which the refrigerant circulates between the evaporator and the cooling unit. The heating mechanism heats the cooling unit and suppresses solidification of the refrigerant at the cooling unit.


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