logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10676635 B1

PDFFull Text
Date of Patent:
Jun. 09, 2020

Filed:

Oct. 23, 2018

Silicone-modified epoxy resin composition and semiconductor device

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Norifumi Kawamura, Annaka, JP;

Shoichi Osada, Annaka, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Megan McCulley

Int. Cl.
CPC ...
C09D 163/00 (2006.01); C08G 59/30 (2006.01); C08G 59/32 (2006.01); H01L 23/29 (2006.01); C08K 3/04 (2006.01); C08K 3/36 (2006.01); C08G 59/62 (2006.01); C08L 83/06 (2006.01); C08G 77/14 (2006.01); C08G 77/16 (2006.01);
U.S. Cl.
CPC ...
C09D 163/00 (2013.01); C08G 59/306 (2013.01); C08G 59/3281 (2013.01); C08G 59/621 (2013.01); C08K 3/04 (2013.01); C08K 3/36 (2013.01); C08L 83/06 (2013.01); H01L 23/296 (2013.01); C08G 77/14 (2013.01); C08G 77/16 (2013.01);
Abstract

The invention provides a silicone-modified epoxy resin composition comprising a silicone-modified epoxy resin having at least two epoxy groups, obtained from hydrosilylation reaction of an alkenyl-containing epoxy compound with an organopolysiloxane, a silicone-modified phenolic resin having at least two phenolic hydroxyl groups, obtained from hydrosilylation reaction of an alkenyl-containing phenol compound with an organopolysiloxane, black pigment, and an inorganic filler. Because of excellent tracking resistance, the epoxy resin composition is suited for encapsulating semiconductor devices.

Find Patent Forward Citations

Kawamura, Norifumi. (2020). Silicone-modified epoxy resin composition and semiconductor device (U.S. Patent No. 10676635). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10676635

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…