The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2020
Filed:
Oct. 23, 2018
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Norifumi Kawamura, Annaka, JP;
Shoichi Osada, Annaka, JP;
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 163/00 (2006.01); C08G 59/30 (2006.01); C08G 59/32 (2006.01); H01L 23/29 (2006.01); C08K 3/04 (2006.01); C08K 3/36 (2006.01); C08G 59/62 (2006.01); C08L 83/06 (2006.01); C08G 77/14 (2006.01); C08G 77/16 (2006.01);
U.S. Cl.
CPC ...
C09D 163/00 (2013.01); C08G 59/306 (2013.01); C08G 59/3281 (2013.01); C08G 59/621 (2013.01); C08K 3/04 (2013.01); C08K 3/36 (2013.01); C08L 83/06 (2013.01); H01L 23/296 (2013.01); C08G 77/14 (2013.01); C08G 77/16 (2013.01);
Abstract
The invention provides a silicone-modified epoxy resin composition comprising a silicone-modified epoxy resin having at least two epoxy groups, obtained from hydrosilylation reaction of an alkenyl-containing epoxy compound with an organopolysiloxane, a silicone-modified phenolic resin having at least two phenolic hydroxyl groups, obtained from hydrosilylation reaction of an alkenyl-containing phenol compound with an organopolysiloxane, black pigment, and an inorganic filler. Because of excellent tracking resistance, the epoxy resin composition is suited for encapsulating semiconductor devices.