The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Dec. 28, 2017
Applicant:

Elite Electronic Material (Kunshan) Co., Ltd., Kunshan, Jiangsu Province, CN;

Inventors:

Yan Zhang, Kunshan, CN;

Mingsheng Yuan, Kunshan, CN;

Ningning Jia, Kunshan, CN;

Rongtao Wang, Kunshan, CN;

Assignee:

ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD., Kunshan, Jiangsu Province, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/053 (2006.01); C08K 5/00 (2006.01); C08L 57/10 (2006.01); C08K 5/06 (2006.01); C08J 5/24 (2006.01); G01N 21/35 (2014.01); G01N 30/00 (2006.01);
U.S. Cl.
CPC ...
C08K 5/0025 (2013.01); C08J 5/24 (2013.01); C08K 5/053 (2013.01); C08K 5/06 (2013.01); C08L 57/10 (2013.01); C08J 2371/12 (2013.01); C08J 2425/10 (2013.01); G01N 2021/3595 (2013.01); G01N 2030/486 (2013.01);
Abstract

Disclosed herein is a resin composition, comprising: a crosslinking agent, its prepolymer, or a combination thereof; and a first unsaturated bond-containing resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board and achieve improvement in at least one, more or all properties including volatile content of prepreg, stickiness of prepreg, resin filling property of prepreg, glass transition temperature, dimensional stability under heat, T288 thermal resistance, thermal resistance after moisture absorption, dielectric constant and dissipation factor.


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