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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10676587 B1

PDFFull Text
Date of Patent:
Jun. 09, 2020

Filed:

Jun. 09, 2017

Heat conductive sheet

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Akihiro Endo, Annaka, JP;

Yasuhisa Ishihara, Annaka, JP;

Toru Tsuchiya, Annaka, JP;

Hisaharu Yamaguchi, Annaka, JP;

Masahiro Moteki, Annaka, JP;

Takahiro Maruyama, Annaka, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

David Sample

Assistant Examiner:

Donald M Flores, Jr

Int. Cl.
CPC ...
C08K 3/22 (2006.01); B32B 27/06 (2006.01); B32B 27/12 (2006.01); B32B 27/20 (2006.01); B32B 27/28 (2006.01); C08K 7/00 (2006.01); C08L 83/06 (2006.01); H01L 23/373 (2006.01); B32B 5/28 (2006.01); H05K 7/20 (2006.01); H01L 23/36 (2006.01); B32B 27/00 (2006.01);
U.S. Cl.
CPC ...
C08K 3/22 (2013.01); B32B 5/28 (2013.01); B32B 27/00 (2013.01); B32B 27/06 (2013.01); B32B 27/12 (2013.01); B32B 27/20 (2013.01); B32B 27/283 (2013.01); C08K 7/00 (2013.01); C08L 83/06 (2013.01); H01L 23/36 (2013.01); H01L 23/3737 (2013.01); H05K 7/20 (2013.01); B32B 2262/101 (2013.01); B32B 2264/102 (2013.01); B32B 2307/302 (2013.01); B32B 2457/00 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/001 (2013.01); C08L 2203/20 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01); C08L 2205/035 (2013.01);
Abstract

A heat conductive sheet comprising a cured product layer of a heat conductive silicone composition on one or both surfaces of a glass cloth sealed using a cured product of a heat conductive resin composition. The heat conductive silicone composition includes an organic silicon compound component and an aspherical heat conductive filler. The amount of the heat conductive filler is 250 to 600 parts by mass with respect to 100 parts by mass of the organic silicon compound component, and the heat conductive filler has a DOP oil absorption of not more than 80 ml/100 g. The heat conductive sheet can be continuously manufactured by coating molding and wound into a roll even with the use of an inexpensive aspherical heat conductive filler, and has high heat conductivity, low thermal contact resistance, and high insulating properties.

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