The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2020
Filed:
Jul. 04, 2016
Applicant:
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Inventors:
Katsuya Tomizawa, Tokyo, JP;
Yoichi Takano, Tokyo, JP;
Meguru Ito, Tokyo, JP;
Eisuke Shiga, Tokyo, JP;
Assignee:
MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/24 (2006.01); B32B 27/30 (2006.01); H05K 1/03 (2006.01); C08L 35/00 (2006.01); B32B 5/00 (2006.01); C08F 2/44 (2006.01); B32B 15/082 (2006.01); C09D 4/00 (2006.01); B32B 27/00 (2006.01); B32B 15/08 (2006.01); C08G 61/10 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
C08J 5/24 (2013.01); B32B 5/00 (2013.01); B32B 15/08 (2013.01); B32B 15/082 (2013.01); B32B 27/00 (2013.01); B32B 27/30 (2013.01); C08F 2/44 (2013.01); C08G 61/10 (2013.01); C08L 35/00 (2013.01); C09D 4/00 (2013.01); H05K 1/03 (2013.01); H05K 1/0373 (2013.01); H05K 1/09 (2013.01); B32B 2307/202 (2013.01); B32B 2307/206 (2013.01); B32B 2457/08 (2013.01); C08J 2361/00 (2013.01); C08J 2465/02 (2013.01);
Abstract
It is intended to provide a resin composition that serves as a raw material for a printed circuit board excellent in heat resistance after moisture absorption and is excellent in moldability. The resin composition of the present invention contains a maleimide compound, a silane compound having a carbon-carbon unsaturated bond and a hydrolyzable group or a hydroxy group, a silane compound having an epoxy skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.