The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Oct. 11, 2018
Applicant:

Elite Electronic Material (Kunshan) Co., Ltd, Kunshan, CN;

Inventors:

Yan Zhang, Kunshan, CN;

Rongtao Wang, Kunshan, CN;

Mingsheng Yuan, Kunshan, CN;

Ningning Jia, Kunshan, CN;

Assignee:

ELITE ELECTRONIC MATERAL (KUNSHAN) CO., LTD., Kunshan, Jiangsu Province, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C07F 9/6571 (2006.01); C09K 21/12 (2006.01); C08K 5/5313 (2006.01); C08J 5/24 (2006.01); C08L 71/12 (2006.01);
U.S. Cl.
CPC ...
C07F 9/657172 (2013.01); C08J 5/24 (2013.01); C08K 5/5313 (2013.01); C08L 71/126 (2013.01); C09K 21/12 (2013.01); C08J 2371/12 (2013.01); C08J 2425/10 (2013.01);
Abstract

A phosphorus-containing compound, a phosphorus-containing flame retardant, and a preparation method thereof are provided. Also provided is a resin composition which comprises the phosphorus-containing flame retardant and an unsaturated bond-containing resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board, and achieves improvement in at least one, more or all properties including resin filling property of prepreg, flame retardancy, alkali resistance, glass transition temperature, thermal dimensional stability (ratio of dimensional change under heat), thermal resistance after moisture absorption, peeling strength, dielectric constant and dissipation factor.


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