The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Nov. 09, 2018
Applicant:

Sii Printek Inc., Chiba-shi, Chiba, JP;

Inventors:

Tomoki Kameyama, Chiba, JP;

Yuki Yamamura, Chiba, JP;

Daichi Nishikawa, Chiba, JP;

Misaki Kobayashi, Chiba, JP;

Assignee:

SII PRINTEK INC., Chiba, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/165 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14201 (2013.01); B41J 2/14072 (2013.01); B41J 2/14209 (2013.01); B41J 2/16505 (2013.01); B41J 2002/14491 (2013.01);
Abstract

A head chip, a liquid jet head, and a liquid jet recording device capable of achieving the miniaturization while enhancing the reliability are provided. The head chip according to an embodiment of the disclosure includes an actuator plate having a plurality of ejection grooves arranged side by side in a first direction, a plurality of non-ejection grooves arranged side by side along the first direction, and individual electrodes respectively formed in the plurality of non-ejection grooves, a nozzle plate having a plurality of nozzle holes individually communicated with the plurality of ejection grooves, and a cover plate adapted to cover the actuator plate. The cover plate has interconnection connecting sections respectively disposed in end part areas along a second direction perpendicular to the first direction, and adapted to electrically connect a plurality of individual interconnections electrically connected to the individual electrodes to an interconnection board outside the head chip. The plurality of individual interconnections in the interconnection connecting section has a bend part extending in an oblique direction crossing the second direction so as to circumvent a predetermined obstacle. A connection area between the plurality of individual interconnections and the interconnection board in the interconnection connecting section is an area including the bend part.


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