The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Jan. 31, 2018
Applicant:

The Government of the United States of America, As Represented BY the Secretary of the Navy, Washington, DC (US);

Inventors:

Jonathan L. Shaw, Springfield, VA (US);

Jeremy Hanna, Fairfax, VA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 15/04 (2006.01); B32B 37/12 (2006.01); B32B 37/24 (2006.01); B32B 38/00 (2006.01); B32B 38/18 (2006.01); H01J 1/34 (2006.01); B23K 1/00 (2006.01); B23K 1/19 (2006.01); B32B 37/04 (2006.01); C23C 28/02 (2006.01); C23C 30/00 (2006.01); H01J 37/073 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B32B 9/007 (2013.01); B23K 1/0016 (2013.01); B23K 1/19 (2013.01); B32B 9/04 (2013.01); B32B 9/041 (2013.01); B32B 15/043 (2013.01); B32B 37/04 (2013.01); B32B 37/12 (2013.01); B32B 37/24 (2013.01); B32B 38/0036 (2013.01); B32B 38/1858 (2013.01); C23C 28/023 (2013.01); C23C 30/00 (2013.01); H01J 1/34 (2013.01); H01J 37/073 (2013.01); B23K 2103/50 (2018.08); B32B 2037/243 (2013.01); B32B 2037/246 (2013.01); B32B 2038/0052 (2013.01); B32B 2250/05 (2013.01); B32B 2255/205 (2013.01); B32B 2255/28 (2013.01); B32B 2309/02 (2013.01); B32B 2309/68 (2013.01); B32B 2311/00 (2013.01); B32B 2311/09 (2013.01); B32B 2311/16 (2013.01); B32B 2313/04 (2013.01); Y10T 428/12542 (2015.01);
Abstract

A thin diamond film bonded to a diamond substrate made by the process of heating a diamond substrate inside a vacuum chamber to about 500° C., cooling the diamond substrate, coating a first surface of the diamond substrate with chromium, depositing an initial layer of palladium, heating the diamond substrate, allowing the chromium and the diamond substrate to form a chemical bond, inter-diffusing the adhesion layer of chromium and the initial layer of palladium, cooling, depositing palladium, placing a shadow mask, degassing the vacuum, depositing a tin layer, assembling the tin layer, heating the tin layer, melting the tin layer, and bonding the thin diamond film to the diamond substrate. A thin diamond film bonded to a diamond substrate comprising a thin diamond film, a layer of chromium, palladium, tin, and a diamond substrate.


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