The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2020
Filed:
Nov. 06, 2015
Sharp Kabushiki Kaisha, Sakai, Osaka, JP;
Geomatec Co., Ltd., Yokohama-shi, Kanagawa, JP;
Nobuaki Yamada, Osaka, JP;
Kiyoshi Minoura, Osaka, JP;
Miho Yamada, Osaka, JP;
Hidekazu Hayashi, Osaka, JP;
Takashi Satoh, Osaka, JP;
Hiroyuki Sugawara, Miyagi, JP;
SHARP KABUSHIKI KAISHA, Osaka, JP;
GEOMATEC CO., LTD., Kanagawa, JP;
Abstract
A manufacturing method of a mold, the mold having at its surface a plurality of recessed portions whose two-dimensional size is not less than 10 nm and less than 500 nm when viewed in a direction normal to the surface, the method including: (a) providing a mold base, (b) partially anodizing an aluminum alloy layer, thereby forming a porous alumina layer which has a plurality of minute recessed portions; and (c) after step (b), bringing the porous alumina layer into contact with a first etching solution, thereby enlarging the plurality of minute recessed portions of the porous alumina layer. Step (a) of providing the mold base includes (a) providing a metal base, (a) forming an aluminum alloy layer on the metal base, and (a) forming a surface protection layer on the aluminum alloy layer. Step (a) and step (a) are performed in a same chamber.