The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Jan. 31, 2019
Applicant:

Delta Electronics, Inc., Taoyuan, TW;

Inventors:

Chao-Li Kao, Taoyuan, TW;

Jin-Zhong Huang, Taoyuan, TW;

Yi-Ping Hsieh, Taoyuan, TW;

Chang-Ye Li, Taoyuan, TW;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/18 (2006.01); H01L 23/40 (2006.01); H02M 7/00 (2006.01); H02M 7/537 (2006.01); F28F 3/02 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); F28F 3/02 (2013.01); H01L 23/4006 (2013.01); H02M 7/003 (2013.01); H02M 7/537 (2013.01); H05K 1/0203 (2013.01); H05K 1/184 (2013.01); H05K 7/20909 (2013.01); H01L 2023/4025 (2013.01); H01L 2023/4043 (2013.01); H01L 2023/4087 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10522 (2013.01);
Abstract

An electronic device with heat sink is provided. The heat sink includes a base and fins. One side of the base has a first placement plane and a second placement plane. The electronic device includes a circuit board, a power module and transistors. The power module includes a power body and soldering legs, and the power body is attached to the first placement plane. The transistor has a transistor body and pins, and the transistor body is attached to the second placement plane. The circuit board is disposed at one side of the base formed with the first placement plane, and soldering legs of the power module and pins of the transistor are inserted on the circuit board. Thereby the heat sinks and the space which the circuit board occupied will be reduced for increasing the power density of the heat sink.


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