The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Feb. 12, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Joseph Kuczynski, North Port, FL (US);

Bruce Chamberlin, Vestal, NY (US);

Scott B. King, Rochester, MN (US);

Matthew Kelly, Oakville, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/05 (2006.01); H05K 1/11 (2006.01); H05K 3/20 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/422 (2013.01); H05K 1/0251 (2013.01); H05K 1/115 (2013.01); H05K 3/429 (2013.01); H05K 3/4611 (2013.01); H05K 2201/095 (2013.01);
Abstract

A stubless via in printed wiring board may comprise one or more core layers. At least one core layer may be circuitized by including a copper trace and at least two other core layers may include copper laminations. The stubless via may further comprise one or more prepreg layers. The prepreg layers may be alternatively stacked between the core layers. the stubless via may further comprise a via. the via may be drilled through each of the alternatively stacked prepreg layers and core layers, exposing internal portions of the prepreg layers and core layers drilled through.


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