The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Jul. 28, 2017
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Kevin George Harding, Niskayuna, NY (US);

Jason Harris Karp, Niskayuna, NY (US);

James William Sears, Niskayuna, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/369 (2011.01); B29C 64/153 (2017.01); B29C 64/214 (2017.01); B29C 64/277 (2017.01); G01N 21/84 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B29C 64/205 (2017.01); B28B 17/00 (2006.01); H04N 1/03 (2006.01); H04N 1/00 (2006.01); H04N 5/225 (2006.01); B22F 3/105 (2006.01); H04N 1/028 (2006.01); B33Y 50/02 (2015.01); B29C 64/393 (2017.01); B28B 1/00 (2006.01); C03B 19/01 (2006.01);
U.S. Cl.
CPC ...
H04N 5/3694 (2013.01); B28B 17/0072 (2013.01); B29C 64/153 (2017.08); B29C 64/205 (2017.08); B29C 64/214 (2017.08); B29C 64/277 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); G01N 21/8422 (2013.01); H04N 1/00827 (2013.01); H04N 1/0306 (2013.01); H04N 5/2256 (2013.01); B22F 3/1055 (2013.01); B22F 2003/1056 (2013.01); B22F 2003/1057 (2013.01); B22F 2999/00 (2013.01); B28B 1/001 (2013.01); B29C 64/393 (2017.08); B33Y 50/02 (2014.12); C03B 19/01 (2013.01); G01N 2021/8427 (2013.01); G01N 2201/1085 (2013.01); G05B 2219/37558 (2013.01); H04N 1/02865 (2013.01); H04N 2201/0084 (2013.01); Y02P 10/295 (2015.11);
Abstract

An imaging device for an additive manufacturing system is provided. The additive manufacturing system includes a material. The imaging device includes a high resolution imaging bar including at least one detector array, and an imaging element positioned between the at least one detector array and the material. The high resolution imaging bar is displaced from the material along a first direction and extends along a second direction. The high resolution imaging bar is configured to generate an image of a build layer within the material.


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