The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Nov. 27, 2015
Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Motohiro Umehara, Yasu, JP;

Yutaka Nabeshima, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/25 (2006.01); H03H 9/10 (2006.01); H03H 3/08 (2006.01); H01L 23/04 (2006.01); H01L 23/08 (2006.01); H03H 9/02 (2006.01); H01L 41/23 (2013.01); H01L 41/29 (2013.01); H01L 41/312 (2013.01); H03H 9/145 (2006.01);
U.S. Cl.
CPC ...
H03H 9/25 (2013.01); H01L 23/04 (2013.01); H01L 23/08 (2013.01); H01L 41/23 (2013.01); H01L 41/29 (2013.01); H01L 41/312 (2013.01); H03H 3/08 (2013.01); H03H 9/02559 (2013.01); H03H 9/1071 (2013.01); H03H 9/14538 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A SAW device includes a SAW element, a conductor connected to the SAW element, an LT substrate including the SAW element, and a case for housing the LT substrate including the SAW element. The case includes a cover part, a lateral part, and a bottom part. The bottom part is including a sapphire substrate, the LT substrate is positioned on a first surface of the sapphire substrate, the first surface serving as an inner surface of the case, and a second surface opposite to the first surface serves as an outer surface of the case. The conductor includes a via conductor provided in a through-hole continuously penetrating through the sapphire substrate and the LT substrate.


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