The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Nov. 07, 2017
Applicant:

Hitachi Automotive Systems, Ltd., Ibaraki, JP;

Inventors:

Youhei Nishizawa, Hitachinaka, JP;

Ayumu Hatanaka, Hitachinaka, JP;

Takeshi Seki, Hitachinaka, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02M 7/00 (2006.01); H05K 7/02 (2006.01); H05K 7/20 (2006.01); H01G 17/00 (2006.01);
U.S. Cl.
CPC ...
H02M 7/003 (2013.01); H01G 17/00 (2013.01); H05K 7/02 (2013.01); H05K 7/209 (2013.01);
Abstract

To improve reliability of a power conversion device with an efficient cooling structure. A power conversion device according to the present invention includes a power semiconductor module configured to convert power, a first capacitor configured to smooth the power, a conductor section forming a first power path between a power terminal and the first capacitor and a second power path between the first capacitor and the power semiconductor module, a noise filter section including a second capacitor that smooths power having a higher frequency than a frequency of the power smoothed by the first capacitor, and a cooling section forming a cooling surface, and the noise filter section is connected to the conductor section forming the first power path, and the conductor section forming the first power path is arranged in a space between the cooling surface and the noise filter section.


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