The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Jun. 29, 2017
Applicant:

Schweizer Electronic Ag, Schramberg, DE;

Inventors:

Thomas Gottwald, Dunningen, DE;

Christian Roessle, St. Georgen, DE;

Alexander Neumann, Rottweil, DE;

Assignee:

SCHWEIZER ELECTRONIC AG, Schramberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); G01S 7/03 (2006.01); G01S 7/02 (2006.01); G06K 19/077 (2006.01); H01Q 1/38 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2225 (2013.01); G01S 7/02 (2013.01); G01S 7/03 (2013.01); G06K 19/0773 (2013.01); H01Q 1/38 (2013.01);
Abstract

A method for producing a radio frequency transmitting/receiving element comprising at least one radio frequency antenna and at least one radio frequency chip, and to a corresponding radio frequency transmitting/receiving element made by the method. The method comprises the following steps: providing a temporary rigid carrier; applying a conductor pattern structure comprising the antenna structure of the at least one radio frequency antenna and connection contacts—connected thereto via leads—for the at least one radio frequency chip; arranging the at least one radio frequency chip on the connection contacts of the conductor pattern structure; applying an electrically insulating layer on the conductor pattern structure, such that the at least one radio frequency chip is surrounded by the electrically insulating layer; and removing the temporary rigid carrier.


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