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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10672962 B1

PDFFull Text
Date of Patent:
Jun. 02, 2020

Filed:

Apr. 10, 2017

Light-emitting semiconductor chip, light-emitting component and method for producing a light-emitting component

Applicant:

Osram Oled Gmbh, Regensburg, DE;

Inventors:

Siegfried Herrmann, Neukirchen, DE;

Michael Völkl, Regensburg, DE;

Assignee:

OSRAM OLED GmbH, Regensburg, DE;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Selim U Ahmed

Assistant Examiner:

Evan G Clinton

Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/38 (2010.01); H01L 33/48 (2010.01); H01L 27/15 (2006.01); H01L 33/00 (2010.01); H01L 33/22 (2010.01); H01L 33/32 (2010.01); H01L 33/44 (2010.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01); H01L 33/60 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 27/15 (2013.01); H01L 33/007 (2013.01); H01L 33/0079 (2013.01); H01L 33/22 (2013.01); H01L 33/32 (2013.01); H01L 33/385 (2013.01); H01L 33/44 (2013.01); H01L 33/48 (2013.01); H01L 33/502 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 25/0753 (2013.01); H01L 33/0095 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0091 (2013.01);
Abstract

A light-emitting semiconductor chip, a light-emitting component and a method for producing a light-emitting component are disclosed. In an embodiment a light-emitting semiconductor chip includes a substrate having a top surface, a bottom surface opposite the top surface and a first side surface extending transversely or perpendicularly to the bottom surface, a semiconductor body arranged on the top surface of the substrate, the semiconductor body comprising an active region configured to generate light and a contacting comprising a first current distribution structure and a second current distribution structure, which is formed to supply current to the active region, wherein the semiconductor chip is free of any connection point on a side of the semiconductor body facing away from the substrate and on the bottom surface of the substrate, and wherein the connection point is a connection point for electrically contacting the first and second current distribution structures.

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