The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Sep. 29, 2017
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Tae Sung Lee, Seoul, KR;

June O Song, Seoul, KR;

Chang Man Lim, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/56 (2010.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 23/00 (2006.01); F21V 23/00 (2015.01); H01L 33/40 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); F21V 23/007 (2013.01); H01L 24/16 (2013.01); H01L 33/40 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01L 33/60 (2013.01); H01L 2224/16257 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/73204 (2013.01);
Abstract

A light emitting device package can include first and second frames spaced apart from each other; a package body including a body portion between the first and second frames; a light emitting device including first and second electrode pads; first and second through holes in the first and second frames, respectively; a first resin between the body portion and the light emitting device; and a conductive material in the first and second through holes, in which the first and second electrode pads of the light emitting device respectively overlap with the first and second through holes, the first and second electrode pads are spaced apart from each other, and the conductive material in the first and second through holes respectively contacts the first and second electrode pads, and a first side surface of the first electrode pad and a second side surface of the second electrode pad facing the first side surface both contact the first resin.


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