The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Dec. 06, 2018
Applicant:

Sun Yat-sen University, Guangdong, CN;

Inventors:

Feng Huang, Guangdong, CN;

Xu Ji, Guangdong, CN;

Mei Dong, Guangdong, CN;

Kun Yan, Guangdong, CN;

Assignee:

SUN YAT-SEN UNIVERSITY, Guangdong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 31/18 (2006.01); C30B 29/16 (2006.01); C30B 33/04 (2006.01); H01L 31/02 (2006.01); H01L 31/08 (2006.01); H01L 31/0224 (2006.01); H01L 31/0296 (2006.01);
U.S. Cl.
CPC ...
H01L 31/1828 (2013.01); C30B 29/16 (2013.01); C30B 33/04 (2013.01); H01L 31/02002 (2013.01); H01L 31/0224 (2013.01); H01L 31/0296 (2013.01); H01L 31/085 (2013.01);
Abstract

The present invention discloses a high-resistivity single crystal zinc oxide (ZnO) wafer and a high-resistivity single crystal ZnO-based radiation detector, and preparation method and use thereof. The preparation method of the high-resistivity single crystal zinc oxide wafer is to place a single crystal ZnO wafer in a metal lithium electrochemical device for a constant-current discharge treatment, and then to place the single crystal ZnO wafer in a high-pressure oxygen atmosphere at 800 to 1000° C. and 10 to 30 atm for an annealing treatment for 20 to 28 hours. The preparation method of the radiation detector is to evaporate a metal electrode layer at both sides of the high-resistivity single crystal ZnO wafer, then to bond the wafer onto a circuit board, and to connect the wafer with the circuit board by a gold thread.


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