The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Jan. 03, 2019
Applicant:

Merlin Solar Technologies, Inc., San Jose, CA (US);

Inventors:

Venkateswaran Subbaraman, San Jose, CA (US);

Gopal Prabhu, San Jose, CA (US);

Venkatesan Murali, Los Gatos, CA (US);

David Tanner, San Jose, CA (US);

Assignee:

Merlin Solar Technologies, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/044 (2014.01); H01L 31/05 (2014.01); H01L 31/0465 (2014.01); H02S 40/34 (2014.01); H01L 31/0224 (2006.01); C25B 11/03 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0508 (2013.01); C25B 11/03 (2013.01); H01L 31/022425 (2013.01); H01L 31/022433 (2013.01); H01L 31/0465 (2014.12); H02S 40/34 (2014.12);
Abstract

Methods include providing an expanded metal article configured as a mesh. The expanded metal article has a plurality of cuts in the mesh and has a surface comprising a plurality of solder pads. A semiconductor material is provided, having a back surface comprising a plurality of silver pads. A front surface of the semiconductor material serves as a light-incident surface of the photovoltaic cell. A front metallic article is provided, the front metallic article comprising a plurality of electroformed elements interconnected to form a unitary, free-standing piece comprising a continuous grid. The continuous grid of the front metallic article is electrically coupled with the front surface of the semiconductor material. The plurality of cuts of the expanded metal article is arranged to relieve stresses induced by the front metallic article on the front surface of the semiconductor material.


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