The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2020
Filed:
May. 02, 2016
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Yumie Kitajima, Tokyo, JP;
Shota Saito, Fukuoka, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/367 (2006.01); H02M 7/00 (2006.01); H02M 1/00 (2006.01); H02M 7/48 (2007.01); H02M 7/5387 (2007.01); H02P 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 23/367 (2013.01); H02M 1/00 (2013.01); H02M 7/003 (2013.01); H02M 7/48 (2013.01); H02M 7/5387 (2013.01); H02P 27/06 (2013.01);
Abstract
A first member of a first semiconductor module and a second member of a second semiconductor module are disposed adjacent to each other along a crossing line segment crossing a longitudinal direction of the first semiconductor module as seen in a plan view. The first member is provided with a first circuit. The second member is provided with a second circuit. The first circuit does not drive when the second circuit is driving. The second circuit does not drive when the first circuit is driving.