The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Dec. 03, 2018
Applicant:

Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;

Inventors:

Karine Saxod, Les Marches, FR;

Marika Sorrieul, Montaud, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 27/146 (2006.01); H01L 31/02 (2006.01); H01L 31/0203 (2014.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/56 (2013.01); H01L 23/315 (2013.01); H01L 23/3121 (2013.01); H01L 24/17 (2013.01); H01L 24/29 (2013.01); H01L 24/30 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/94 (2013.01); H01L 24/97 (2013.01); H01L 27/14618 (2013.01); H01L 27/14683 (2013.01); H01L 31/0203 (2013.01); H01L 31/02005 (2013.01); H01L 23/481 (2013.01); H01L 24/13 (2013.01); H01L 24/48 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/13291 (2013.01); H01L 2224/14179 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29291 (2013.01); H01L 2224/30135 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/73257 (2013.01); H01L 2224/81862 (2013.01); H01L 2224/81874 (2013.01); H01L 2924/00012 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/16235 (2013.01); H01L 2924/16315 (2013.01); H01L 2924/181 (2013.01);
Abstract

A method for fabricating an electronic device includes fixing a rear face of an integrated-circuit chip to a front face of a support wafer. An infused adhesive is applied in the form of drops or segments that are separated from each other. A protective wafer is applied to the infused adhesive, and the infused adhesive is cured. The infused adhesive includes a curable adhesive and solid spacer elements infused in the curable adhesive. A closed intermediate peripheral ring is deposited on the integrated-circuit chip outside the cured infused adhesive, and an encapsulation block is formed such that it surrounds the chip, the protective wafer and the closed intermediate peripheral ring.


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