The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2020
Filed:
Oct. 12, 2018
Applicant:
Socionext Inc., Yokohama-shi, Kanagawa, JP;
Inventors:
Tomoyuki Yamada, Kawasaki, JP;
Fumio Ushida, Kawasaki, JP;
Shigetoshi Takeda, Kawasaki, JP;
Tomoharu Awaya, Kawasaki, JP;
Koji Banno, Kawasaki, JP;
Takayoshi Minami, Kawasaki, JP;
Assignee:
SOCIONEXT INC., Yokohama, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/78 (2006.01); H01L 23/58 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/78 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 23/53228 (2013.01); H01L 23/53238 (2013.01); H01L 23/585 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor device provided on a semiconductor substrate includes an element region including an element, a moisture-resistant frame surrounding the element region, an insulating layer provided between the moisture-resistant frame and an outer peripheral edge of the semiconductor device and on the semiconductor substrate, a first metal line extending along the outer peripheral edge and provided in the insulating layer, and a groove provided in the insulating layer.