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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10672697 B1

PDFFull Text
Date of Patent:
Jun. 02, 2020

Filed:

Jul. 13, 2016

Wiring board and electronic package

Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventor:

Akihiko Funahashi, Kagoshima, JP;

Assignee:

KYOCERA Corporation, Kyoto-Shi, Kyoto, JP;

Attorney:

Volpe and Koenig, P.C.

Primary Examiner:

Tan N Tran

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 27/14 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 33/62 (2010.01); H05K 3/46 (2006.01); H05K 3/12 (2006.01); H05K 1/18 (2006.01); H01L 23/15 (2006.01); H01L 23/13 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/4857 (2013.01); H01L 21/4867 (2013.01); H01L 24/48 (2013.01); H01L 27/14 (2013.01); H05K 1/0271 (2013.01); H05K 1/11 (2013.01); H01L 23/13 (2013.01); H01L 23/15 (2013.01); H01L 23/49822 (2013.01); H01L 24/45 (2013.01); H01L 33/62 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/83385 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/14 (2013.01); H01L 2924/146 (2013.01); H05K 1/183 (2013.01); H05K 3/1216 (2013.01); H05K 3/4629 (2013.01); H05K 3/4697 (2013.01); H05K 2201/09736 (2013.01); H05K 2203/049 (2013.01);
Abstract

A wiring board and an electronic package maintain the flatness of the surface of the wiring board. The wiring board includes a flat insulating layer having a flat upper surface, and a conductive layer on the upper surface of the insulating layer with a space left from an outer edge of the insulating layer. The conductive layer includes a peripheral portion, a central portion inward from the peripheral portion, and a linear portion included in the central portion. The peripheral portion is raised along the outer edge of the insulating layer. The linear portion is raised to a height position of the peripheral portion.

Find Patent Forward Citations

Funahashi, Akihiko. (2020). Wiring board and electronic package (U.S. Patent No. 10672697). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10672697

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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