The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2020
Filed:
Jan. 04, 2017
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Dong-suk Kim, Suwon-si, KR;
Kyong-soon Cho, Incheon, KR;
Shle-ge Lee, Seoul, KR;
Yu-duk Kim, Suwon-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A printed circuit board (PCB) reducing a thickness of a semiconductor package and improving reliability of the semiconductor package, a semiconductor package including the PCB, and a method of manufacturing the PCB may be provided. The PCB may include a substrate base having at least one base layer, and a plurality of wiring layers disposed on a top surface and a bottom surface of the at least one base layer, the plurality of wiring layers defining a plurality of wiring patterns, respectively may be provided. An elastic modulus of a conductive material of one wiring pattern of at least one wiring layer from among the plurality of wiring layers may be less than a conductive material of another wiring pattern.