The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2020
Filed:
Sep. 24, 2019
Deere & Company, Moline, IL (US);
Robert K. Kinyanjui, West Fargo, ND (US);
Thomas J. Roan, Fargo, ND (US);
Michael J. Zurn, Pelican Rapids, MN (US);
Brad G. Palmer, Fargo, ND (US);
Brij N. Singh, West Fargo, ND (US);
DEERE & COMPANY, Moline, IL (US);
Abstract
A method for manufacturing an electronic assembly features a semiconductor device with a first side and a second side opposite the first side to facilitate enhanced thermal dissipation. The first side has a first conductive pad. The second side has a primary metallic surface. By heating the assembly once, a first substrate (e.g. lead frame) is bonded to a first conductive pad via first metallic bonding layer; and second substrate (e.g., heat sinking circuit board) is bonded to a primary metallic surface via a second metallic bonding layer. In one configuration the second metallic bonding layer is composed of solder and copper, for example.