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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10672659 B1

PDFFull Text
Date of Patent:
Jun. 02, 2020

Filed:

Feb. 23, 2018

Electronic component manufacturing method

Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Yuichi Kazue, Tokyo, JP;

Assignee:

Canon Kabushiki Kaisha, Tokyo, JP;

Attorney:

Canon U.S.A. Inc., IP Division

Primary Examiner:

Peniel M Gumedzoe

Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/288 (2006.01); H01L 21/3213 (2006.01); H01L 21/285 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); H01L 21/2885 (2013.01); H01L 21/28568 (2013.01); H01L 21/32134 (2013.01); H01L 21/32136 (2013.01); H01L 21/76846 (2013.01); H01L 21/76873 (2013.01); H01L 21/78 (2013.01); H01L 23/481 (2013.01); H01L 24/94 (2013.01); H01L 21/32139 (2013.01); H01L 21/76852 (2013.01); H01L 21/76885 (2013.01); H01L 23/528 (2013.01); H01L 23/53214 (2013.01); H01L 23/53257 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/13025 (2013.01); H01L 2924/37001 (2013.01);
Abstract

An electronic component manufacturing method includes preparing a structure including a conductive member, forming a seed metal layer including first and second portions electrically connected to the conductive member on a surface of the structure, forming a plating layer on the first portion of the seed metal layer in a state in which the second portion of the seed metal layer is covered by a first member, forming a conductive second member on the first portion of the seed metal layer via the plating layer, and etching the second portion of the seed metal layer in a state in which the plating layer is covered by the second member.

Find Patent Forward Citations

Kazue, Yuichi. (2020). Electronic component manufacturing method (U.S. Patent No. 10672659). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10672659

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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